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TCD1709D
TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device)
TCD1709D
The TCD1709D is a high sensitive and low dark current 7500 pixels CCD image sensor. The sensor is designed for facsimile, imagescanner and OCR. The device contains a row of 7500 pixels photodiodes which provide a 24 lines/mm (600DPI) across a A3 size paper. The device is operated by 5-V (pulse), and 12-V power supply.
Features
* * * * * * Number of image sensing pixels: 7500 pixels Image sensing pixel size: 7 m by 7 m on 7-m center Photo Sensing Region : High sensitive and low voltage dark signal pn photodiode Clock: CMOS 5-V drive Power supply voltage: 12-V power supply Package: 68-pin CERDIP Weight: 16.0 g (typ.)
Maximum Ratings (Note 1)
Characteristics Clock pulse voltage Shift pulse voltage Reset pulse voltage Clamp pulse voltage Power supply voltage Operating temperature Storage temperature Symbol Vf VSH VRS VCP VOD Topr Tstg -0.3 to 15 0 to 60 -25 to 85 C C -0.3 to 8 Rating Unit
V
Note 1: All voltages are with respect to SS pins (ground).
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TCD1709D
Pin Connections (top view)
OS2 OS1 OD OD f1A1 f2A1 NC NC NC NC NC NC NC NC NC NC NC NC f2A3 f1A3 f2B SH RS CP NC NC NC NC NC NC NC NC NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
1
68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36
CP RS SS f2B f1A2 f2A2 NC NC NC NC NC NC NC NC NC NC NC NC f2A4 f1A4 OD SS OS4 OS3 NC NC NC NC NC NC NC NC NC NC
7500
35
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Circuit Diagram
SS 66 CP 68 RS f2B 67 65 f1A2 64 f2A2 63 f2A4 50 f1A4 49 OD 48 SS 47
OS2
1
Signal output buffer
CCD analog shift register 2
CCD analog shift register 4
Signal output buffer
46 OS4 22 SH
Shift gate 2 D28 D27 D26 D26 D27 D28 .... Photo diode Shift gate 1 OS1 2 Signal output buffer CCD analog shift register 1 CCD analog shift register 3 Signal output buffer S7498 S7499 S7500 D127 D126 D126 D127 S1 S2 S3 ....
45 OS3
3 OD
4 OD
5 f1A1
6 f2A1
19 f2A3
20 f1A3
21
23
24 CP
f2B RS
Pin Names
f1A1, 2, 3, 4 f2A1, 2, 3, 4 f2B SH RS CP OS1 OS2 OS3 OS4 OD SS NC Clock (phase 1) Clock (phase 2) Last stage clock (phase 2) Shift gate Reset gate Clamp gate Output signal 1 Output signal 2 Output signal 3 Output signal 4 Power supply Ground No connect
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TCD1709D
(Ta = 25C, VOD = 12 V, VB= VSH = VRS = VCP = 5 V (Pulse), fB = 1 MHz, tINT (integration time) = 10 ms, light source = daylight fluorescent lamp, load resistance = 100 kW) W
Characteristics Sensitivity Photo response non uniformity Saturation output voltage Saturation exposure Dark signal voltage Dark signal non uniformity DC power dissipation Total transfer efficiency Output impedance Dynamic range DC signal output voltage DC differential error voltage Random noise Symbol R PRNU PRNU (3) VSAT SE VDRK DSNU PD TTE Zo DR VOS |VOSX-VOSY| NDs Min 12 3/4 3/4 1.5 0.08 3/4 3/4 3/4 92 3/4 3/4 4.5 3/4 3/4 Typ. 15 3 5 2.0 0.16 1 2 800 98 0.2 2500 6 3/4 0.7 Max 18 10 12 3/4 3/4 3 6 1040 3/4 1 3/4 7.5 300 3/4 Unit V/(lxs) % mV V lxs mV mV mW % kW 3/4 V mV mV (Note 6) (Note 7) (Note 9) (Note 10) (Note 2) (Note 8) (Note 3) (Note 4) (Note 5) (Note 5) Note
Optical/Electrical Characteristics
Note 2: Measured at 50% of SE (typ.) Definition of PRNU : PRNU =
Dc c 100 %
Where ? is average of total signal outputs and ,? is maximum deviation from ? under uniform illumination (Channel 1). In the case of 1875 pixels (channel 2, channel 3 and channel 4), the condition is the same as above too. Note 3: VSAT is defined as minimum saturation output voltage of all effective pixels. Note 4: Definition of SE: SE =
VSAT (lxs) R
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Note 5: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined by the difference between average value (VDRK) and the maximum value of the dark voltage.
OS VDRK DSNU
Note 6: Definition of DR : DR =
VSAT VDRK
VDRK is proportional to tINT (integration time). So the shorter tINT condition makes wider DR values. Note 7: DC signal output voltage is defined as follows:
OS
VOS SS
Note 8: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (typ.) Note 9: DC differential error voltage is defined as follows: Definition of DC differential error voltage = |VOSX - VOSY| VOSX : Maximum DC signal output voltage VOSY : Minimum DC signal output voltage
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TCD1709D
Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark condition) calculated by the following procedure.
Video output
Video output
Output waveform (effective pixels under dark condition)
200 ns
200 ns s
pixel n
pixel (n + 1)
1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. 2) Each of the output levels at video output periods averaged over 200 nanosecond period to get Vn and Vn + 1. 3) Vn + 1 is subtracted from Vn to get V. V= Vn - Vn + 1 4) The standard deviation of V is calculated after procedure 2) and 3) are repeated 30 times (30 readings).
DV = 1 30 a DVi 30 i=1
s=
2 1 30 a DVi - DV 30 i=1
5) Procedure 2), 3) and 4) are repeated 10 times to get 10 sigma values.
s= 1 10 a sj 10 j=1
6) I value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify the random noise as follows. Random noise =
1 2
I
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TCD1709D
Operating Condition
Characteristics Clock pulse voltage High level Low level High level Low level High level Low level High level Low level High level Low level Symbol Vf1A Vf2A Vf2B Min 4.5 0 4.5 0 4.5 0 4.5 0 4.5 0 11.4 Typ. 5 3/4 5 3/4 5 3/4 5 3/4 5 3/4 12 Max 5.5 0.5 5.5 0.5 5.5 0.5 5.5 0.5 5.5 0.5 13 Unit V
Last stage clock voltage
V
Shift pulse voltage
VSH
V
Reset pulse voltage
VRS
V
Clamp pulse voltage Power supply voltage
VCP VOD
V V
Clock Characteristics (Ta = 25C)
Characteristics Clock pulse frequency Reset pulse frequency Clock capacitance Last stage clock capacitance Shift gate capacitance Reset gate capacitance Clamp gate capacitance (Note 11) Symbol ff fRS CfA CfB CSH CRS CCP Min 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 1 1 200 20 40 20 20 Max 25 25 3/4 3/4 3/4 3/4 3/4 Unit MHz MHz pF pF pF pF pF
Note 11: VOD = 12V
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Timing Chart
SH
CP
RS
f1A1, 2, 3, 4
OS4
OS3
OS2
OS1
f2A1, 2, 3, 4 f2B
*1: RS and CP stopped. Dummy outputs (13 pixels 4) Dummy outputs (64 pixels 4) 1 line readout period (1939 pixels 4) Light shild outputs (48 pixels 4)
*1
D0 D2 D4
D1 D3 D5
D1 D3 D5
D0 D2 D4
0 1 2 3
D26 D28 D30 D32 D34 D36 D38 D40 D42
D27 D29 D31 D33 D35 D37 D39 D41 D43
D27 D29 D31 D33 D35 D37 D39 D41 D43
D26 D28 D30 D32 D34 D36 D38 D40 D42
13 14 15 16 17 18 19 20 21 22
D120 D122 D124 D126 S7500 S7498
D121 D123 D125 D127 S7499 S7497
D121 D123 D125 D127 S2 S4
D120 D122 D124 D126 S1 S3
tINT (integration time)
8
(3 pixels 4) Signal outputs (1875 pixels 4)
60 61 62 63 64 65
S3760 S3758 S3756 S3754 S3752
S3759 S3757 S3755 S3753 S3751
S3742 S3744 S3746 S3748 S3750
S3741 S3743 S3745 S3747 S3749
1934 1935 1936 1937 1938
TCD1709D
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TCD1709D
Timing Requirements
SH, f1 Timing t2 SH t1 f1A t5 RS t17 t3 t4 f2B t8 t9 t10 t15 f2, RS, CP, OS Timing t6 t7
t16 CP t12 t11 SH, RS, CP Timing SH t19 RS t17 CP f2 GND RS, CP period (Note 12) t18 t16 f1 OS1 OS2 OS3 OS4 f1, f2 Cross point
t13
t14
1.5 V (min) 1.5 V (min)
Note 12: RS and CP must be stopped during this period.
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Characteristics Pulse timing of SH and f1A SH pulse rise time, fall time SH pulse width f2B pulse rise time, fall time RS pulse rise time, fall time RS pulse width Video data delay time CP pulse rise time, fall time CP pulse width Pulse timing of f2B and CP Pulse timing of RS and CP Pulse timing of SH and CP Pulse timing of SH and RS (Note 14) Symbol t1, t5 t2, t4 t3 t6, t7 t8, t10 t9 t11 t12, t14 t13 t15 t16 t17 t18 t19 Min 500 0 1000 0 0 10 3/4 0 10 0 0 10 200 200 Typ. (Note 13) 1000 50 1500 100 20 100 10 20 200 50 0 100 3/4 3/4 Max 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
Note 13: Measured with fRS = 1 MHz. Note 14: Load resistance is 100 kW.
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TCD1709D
Caution
1. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. b. c. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range.
2. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage.
3. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor.
4. Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C.
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Package Dimensions
Unit: mm
Weight: 16.0 g (typ.)
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TCD1709D
RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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